IPC 4104

$79.00

Specifications for High Density Interconnect (HDI) and Microvia Materials

Published by Publication Date Number of Pages
IPC 05/01/1999 100

Description

IPC 4104 – Specifications for High Density Interconnect (HDI) and Microvia Materials

Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias.The 23 specification sheets included in IPC/JPCA-4104 specify the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC 4104 also includes six new test methods developed specifically for the testing of HDI and microvia materials.

Product Details

Published:
05/01/1999
ANSI:
ANSI Approved
Number of Pages:
100
File Size:
1 file , 440 KB
Product Code(s):
4104(D)1
Note:
This product is unavailable in Russia, Ukraine, Belarus